美国AMTECH amtech公司

产品图片	产品名称/型号	产品简单介绍
	BGA助焊膏 NC-559-ASM	BGA助焊膏产品介绍:美国AMTECH研发了两种使用于手机PCB，BGA及PGA等SMD之返修助焊膏，它使用于低离子性之活化剂系统，润锡速度快，冒烟程度很低，残留物固化后之表面绝缘阻抗值很高，因此，对手机等通讯产品之电性干扰非常小.
	AMTECH助焊膏 RMA-223-UV	AMTECH助焊膏(NC-559和RMA-223)二.产品介绍:美国AMTECH研发了两种使用于手机PCB，BGA及PGA等SMD之返修助焊膏，它使用于低离子性之活化剂系统，润锡速度快，冒烟程度很低，残留物固化后之表面绝缘阻抗值很高，因此，对手机等通讯产品之电性干扰非常小.
	美国AMTECH助焊膏 RMA-223-uv/NC-559-asm	美国AMTECH助焊膏(NC-559和RMA-223)二.产品介绍:美国AMTECH研发了两种使用于手机PCB，BGA及PGA等SMD之返修助焊膏，它使用于低离子性之活化剂系统，润锡速度快，冒烟程度很低，残留物固化后之表面绝缘阻抗值很高，因此，对手机等通讯产品之电性干扰非常小.
	水洗助焊膏 LF-4300-TF	水洗助焊膏LF-4300-TFThe LF-4300-TF is a medium viscosity water-washable, no-clean flux designed for tin-lead and lead-free alloys. LF-4300-TF is ideal for BGA
	无卤助焊膏 NC-560-LF	无卤助焊膏NC-560-LF is an RoHS-compliant lead-free, no-clean solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold)
	AMTECH无铅锡膏 AMTECH solder pastes	AMTECH无铅锡膏Solder Paste formulae designed for today’s Surface Mount Technologies. All AMTECH solder pastes are available for immediate delivery in jars
	AMTECH水洗锡膏 NWS-4200	AMTECH水洗锡膏All AMTECH solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes.
	AMTECH水洗无铅锡膏 NWS-4400-HA	AMTECH水洗无铅锡膏AMTECH NWS-4400-HA solder paste was designed for hard-to-solder surfaces with a higher activity. The NWS-4400-HA is classified as REL0 and is available in both leaded and non-leaded alloys. Residues can be removed with de-ionized or soft tap water at 130-150° F.
	AMTECH助焊笔 AMTECH FLUX-RIGHTER	AMTECH助焊笔All AMTECH liquid fluxes are available in Flux-Righters, a unique tool for rework and touch-up soldering.

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