○Recommended curing condition:Over 60 sec after PCB’s surface temperature has reached 150℃.or over 90 sec after PCB’s surface temperature has reached 120℃. ○When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs. | 固化条件 ○建议固化条件是PCB板表面温度达到150℃后120秒以上,或者是达到120℃后150秒以上。 ○固化温度越高,且固化时间越长,可获得更高的粘接强度,依PCB板上装着元件材质、大小不同而实际附加于接着剂的温度会有所不同,因此请依据实际生产情况找出最适合的固化条件。 |