千住水溶性锡膏
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产品名称:
千住水溶性锡膏
产品型号:
M705-515A（8）C1-T8G
产品展商:
千住金属
产品文档:
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简单介绍
锡96.5、银3.0、铜0.5###熔点:217-220℃###粘度:180-220Pa.s###230-260℃###要求无松香残留的工艺，纯水能轻松清洗残留物###0-10℃
千住水溶性锡膏
的详细介绍
千住水溶性锡膏 M705-515A(8)C1-T8G（无卤素锡膏）及M705-WSG15为千住金属开发之水洗性锡膏.
１．Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
２．Standard
２.１ Chemical composition of solder alloy（Test method ： STM-9-1）
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ａｇ3.0 ± 0.1 /Ｃｕ0.50 ± 0.05/Ｓｎ
２.２ Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ～ 220
